Multigig Vita41/46连接系统
Tyco Electronics

• Customizable impedance matched printed circuit wafer interface
• Inverse sex backplane connector system with “pinless” interface
• Superior crosstalk performance
• Optimized footprints for signal integrity and ease of board design
• Utilizes a .022 inch diameter via for lower cost board fabrication
• Three levels of signal contact sequencing
• Telcordia / Bellcore Compliant
• Available in modular or monoblock style
• Available for 0.8” (20.3mm) or 1.0” (25.4mm) card pitch systems
• Durability rated for 250 Cycles
• Fully compatible with MP based fiber optic array interconnects
• Complete connector family includes
  • Power Modules => Maximize Amps/inch density, voltages in pairs
  • Guidance Modules
    
    • Die cast for strength
    • Optional ESD contact
    • Three sequence levels
    • Pressfit or hardware mounted
    • Backplane drill pattern enabled keying