CyberOptics SE-300 SPI锡膏厚度测试仪
KEEPING PACE WITH DEMANDING LINE SPEEDS CyberOptics? 100% 3D solder paste inspection system, the SE 300 Ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of your line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control. NEW FEATURES ? Multi-panel 1-D and 2-D barcode read using the system sensor ? Mechanical board stop solution ? Programming time improvement—less than 15 minutes with ODB++ file import ? Offline defect review capability ? Program call-up using bar code reader ? Robust flexible PCB warp compensation algorithm - Designed to compensate for complex warp within a field of view ? New optional sensor with an extended height range—up to 24 mils (610 microns) FIELD-PROVEN TECHNOLOGY ? High-resolution 3D sensing technology to inspect the most demanding assemblies with even subtle printing errors ? High-speed/high-resolution inspection modes to optimize system performance ? 3D height, true volume and area measurements for those PCBs with CSPs, 0201s or other small pad sizes where measuring solder volume is key for identifying solder joint reliability ? Registration measurement and bridge detection to help you fine-tune printer set up and monitor process drift ? 3D shaded view for examining solder paste deposits ? XML file format output for easy integration to Shop Floor Control systems SYSTEM ? 3D sensing system with built-in fiducial camera and lighting ? Adjustable-width, clamping conveyor system, retracts for easy board removal ? CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive ? Pentium? 4 processor: data handling and image processing
3-D 焊膏检测系统 SE 300
Ultra。
供应3D 锡膏检测仪(SPI) SPI 锡膏测厚仪，在线 SPI
这种新一代在线100%锡膏检测系统把 SE 300提升到全新的水平。SE 300 Ultra 快速提供了准确的、
可靠的重复性的结果，满足了日益提高的生产线周期要求。SE 300 Ultra 采用 SE 300经过实地验证
的技术和可靠的功能，同时增加了许多新功能。
新功能包括：改善了编程时间和检测设置；操作用户界面中提供了 SPC 图表；选配的光学系统，扩
大了高度检测范围，可以测量高达24 mils (610 μm)的高度；安全的机械性电路板停板检测解决方案。
增加的其它最新功能包括：使用系统传感器实现1-D 和2-D 多条码读取功能；离线缺陷检修工作站，
允许用户简便地离线检修缺点，最大限度地提高生产线产量；技术领先的01005焊盘检测功能；增
强的柔性印制电路板起翘补偿功能；简便易用的使用者操作界面和缺陷检修功能；传送带自动宽度
调节功能。
该系统提供了超快速检测速度，传送带容纳从101 x 35 mm (4 x 1.4")到508 x 508 mm (20 x 20")
的面板尺寸。它提供了灵活的传送带轨道选项，包括前面固定轨道和后面固定轨道，使用条码读取
选用程序，并能够读取非检测区块点，并从检测结果中排除数据。
此外，SE 300 Ultra 能够处理异型焊盘，提供了杰出的焊膏高度精度每一个焊盘测量数据资料由20
万个测量点记算得出和 XML 文件格式输出，可以简便地集成到车间控制系统中。Ultra 还拥有焊膏
高度、面积和容量测量功能，支持小于10%的 Gage R&R
